Specializing in sustainable, in-depth solutions, STS offers a broad range of analytical services for Aerospace, Medical, Industrial and Commercial semiconductor devices. Our unique analytical capabilities prove invaluable during the design and manufacturing phases in the event of a failure.

STS has a comprehensive set-up for validating a failed device through advanced diagnostic techniques. Our pristine tools and techniques together with sound analytical interpretation offer customers thorough information regarding a product failure.

STS partners with MuAnalysis Inc. a recognized supplier of analytical and reliability services to the microelectronics and photonics industries. MuAnalysis’ expertise in design debug and failure analysis complements STS’ extensive test and reliability engineering capabilities. Together, MuAnalysis and STS seamlessly support the product time-to-market needs and the quality objectives of their customers by helping to minimize design, manufacturing, and testing costs.

STS is also affiliated with Sonix, a leading manufacturer of scanning acoustic microscopes and non-destructive testing equipment. Sonix has its West Coast Application center at STS and offers device failure analysis, new package qualification, production sampling and more.

• X-Ray
• Scanning Acoustic Microscopy
• Topography and Deformation Measurements
• Decapsulation
• Visual Inspection
• Optical Microscopy
• Laser Scanning Microscopy (LSM)
• Pin Testing
• Static DC Biasing
• Liquid Crystal Fault Isolation
• Emission Microscopy (EMMI)
• Optical Beam Induced Current (OBIC)
• Backside Emission Microscopy
• Various optical techniques for fault isolation
• Delayering or cross-sectioning
• Scanning Electron Microscopy (SEM)
• Microprobing, with picoprobes
• BGA layer by layer construction analysis
• Dynamic Electroluminescence Imaging (DEI)
• Fluorescent Microthermal Imaging (FMI)