Products & Services ELECTRICAL PERFORMANCE VALIDATION
PRECISION-DRIVEN ELECTRICAL TESTING OF INCREASINGLY COMPLEX AND HIGH-SPEED DEVICES
A MATURED PRODUCTION-CAPABLE TEST PARTNER
CONTINUOUS INNOVATION TO ENHANCE EFFICIENCY AND REDUCE COST OF TEST (COT)
STS offers a full range of electrical test services for Memories, ASIC’s, ASSP’s, RF, Mixed Signal, Digital, Logic, Digital, SOC’s, SIP’s and Power applications.
We have a core dedicated staff of product, process and
test engineers capable of developing custom solutions to
address any specific device requirements. STS engineers
have inherent knowledge to design programs by product
type, application, expected launch timeline, end customer
requirements, ASP constraints, and by assembly/package
type.
STS Offers a Total Test Solution
Mixed Signal Applications
PCI Express, Serial ATA
20GHz RF
High-speed SERDES
Hyper Transport, Dual TMDS
20 Gbs Digital IC’s
Controllers
Network Processors
SRAM/ SSRAM
DRAM/ SDRAM
DDR2, DDR3, QDR
STS Offers a Total Test Solution
- Devise the Platform Lifecycle Plan
- Test Plan and Infrastructure Development
- Program Development
- Migration Strategies for New and Multiple Platforms
- System-level and Wafer-level Testing
- Complete Test Development, Migration and Military Temperature Qualification for Hi-Reliability Products
- COTS to TRL
- Test Flows for Legacy, Diminished Manufacturing Sources and End-of-Life Products
PRODUCT EXPERIENCE
ASIC’sMixed Signal Applications
PCI Express, Serial ATA
20GHz RF
High-speed SERDES
Hyper Transport, Dual TMDS
20 Gbs Digital IC’s
Controllers
Network Processors
SRAM/ SSRAM
DRAM/ SDRAM
DDR2, DDR3, QDR
TEST HARDWARE
STS designs and builds its own hardware – such as load boards, probe cards, change kits, custom fixtures etc. MorePRODUCT ENGINEERING
- IP Validation
- Silicon/Package Validation
- Test Program Debug
- Cycle to Cycle Correlation
- Superior Diagnostics and Product Failure Analysis
- Yield Analysis
- Yield Perfection
- Release Controls
- Dedicated Product, Test and Device Engineers
TEST PROGRAM DEVELOPMENT
- Digital Speed Scalability of 3.6 Gbps
- Leading-edge Development Tools / Cross Compilers
- Integration of EDA to Test Tools for Rapid Deployment of Test Programs
- Device Performance to Design across Temperature, Voltage and Process Margins
- Early Characterization
- Efficiency Improvement – Migration Models
TEST HARDWARE
- Design and Develop Highly Complex Load boards
- Design in Intelligence and Engineered Quality
- More
HI-RELIABILITY TESTING
- Hi-reliability Screening and Military Temperature Qualification
- Commercial to Industrial Grades and Military Grades
- Prevention of Value Leakage
- Lot Acceptance
- QCI Testing
- COTS Replacement
- Counterfeit Detection
PRODUCTION TEST
FINAL TEST
- Multi-functional Testing for SoC’s
- High Volume Single, Dual and Quad Site Testing
- Multi-site, Multi-temperature Testing
- Benchmarking
- No-touch Subcontracting
WAFER PROBE / WAFER SORT
- 300mm Prober
- Thermal Control
- Multi-site Probing
- Bake Retention
- Bumped Wafer Probing
- In-Line or Off-Line Inking
- Wafer Mapping Software
- Auto Wafer and Probe-to-Pad Alignment
- Check for Continuous Fail Alert System
- Probe Mark & Wafer ID Inspection
BACKEND SERVICES
- Proprietary Lot Tracking Software
- Lead Scanning
- Dry Packing
- Tape and Reel
- Drop Shipment
- Box Stock Management
PRODUCTION TRANSFER PACKAGE FOR OFFSHORE PRODUCTION
- Software Development
- Pre-production
- Correlation
- Optimization
- Sample Testing
- RMA’s
- Yield Management
EQUIPMENT ENGINEERING
- Advanced Machine-control Technology
- Calibration and Maintenance
- Coordination of Sockets, Contactors, Device Trays