Alternate Energy Testing Hi-Reliability Specialty Assembly Reliability & Qualification ESD & Latch-up ATE Solutions Hardware Design & Manufacturing
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Silicon Turnkey Solutions
 
Ceramic & Hermetic Pakage Assembly System on Chip (soc) MEM's FC & COB's Multiple High & Low Pin Test Platform Test Program Development & Characterization Mixed Signal to Pure Digital / RF Testing Final Test & Wafer sort Multi-Temperature Testing 24x7 Production Testing Assembly Profile Simulation & Preconditioning Bond / Die Lead Stress Analysis Mechanical Shock Vibration & Centrifuge Real Time X-Ray Analysis Moire Analysis (3D Warpage Profile at tempreture) Thermal Analysis Group B & D device per MIL-PRF-38535 JDEC,MIL std,. IPC , EIAJ, IEC, STACK, CECC. JDEC, MIL Std,. IPC,EIAJ, IEC, STACK,CECC Acoustic Imaging Autoclave Strep Stress Burn-In HAST Tempreture Shock / Cycle Testing THB 85c, 85% RH Life Test HTOL LTOL Level1 & Level2 Rel. Testing Air-Discharge & Control ESD Testing Electro-Thermally Induced Parasitic Gate Leakage Test Charged Device Model Machine Model Human Body Model Mechanical & Reliability Analysis Environment Testing Probe Cards & ATE Load Boards Turn key ins house design, Manufacturing < Bom Advanced PCB Desigh Technology Static & Dynamic Burn-in-Board Blased Hast Boards & THB ESD & Latch-up Boards