Semiconductor technology moves so fast that many devices reach their end of life (EOL) within a few years, either because demand is falling or they have been replaced by improved devices with additional features and specifications. However, the new devices often are not pin-to-pin, spec-to-spec replacements for the EOL legacy devices, which makes it difficult for OEMs to continue to build and support legacy military and space products that rely on the EOL device.
Based on our extensive experience with this all-too-common scenario, STS has developed a deep understanding of how to manage semiconductor obsolescence and mitigate the risks associated with EOL devices. Our design engineers will consult with you to determine which of our services best meets your needs.
When you are unable to get access to the EOL device’s manufacturing tooling and process specification, STS can help you start over from your existing intellectual property, which is usually in the form of hardware description languages such as Verilog and VHDL. Our redesign capabilities include:
- Convert FPGAs to ASICs
- Design and produce FPGA and evaluation platform
- Design for testability and manufacturability
- Deliver finished devices using your netlist, EDIF or HDL file
When you have a need to change packaging, STS engineers have the expertise and experience to design packing solutions with precise compatibility in form, fit and function. This service is particularly useful when you must reduce power consumption to meet new standards.
Even minor changes to a critical part may require re-certification. STS engineers have navigated this obstacle many times and have the know-how to retest devices to meeting functional and quality requirements and validate compliance to the original specifications.
STS offers trusted device re-creation solutions that guarantee performance and device integrity with the authorization of the original manufacturers. This service reduces risk, enhances quality, sustains part availability and protects against counterfeits.
Lifetime Supply Continuity
When you need to bank dies and wafers, STS offers a dedicated storage area in an ESD-controlled environment. The storage area is highly secure and confined with bonded inventory control.
The semiconductor market is plagued with technology cloning, rebranding and mislabeling of substandard or defective electronic components to imitate higher-qualification EEE parts. To counter this threat, STS has developed a comprehensive process for detecting counterfeit devices:
- Visual inspection
- Documentation check
- Dimensions and marking compliance
- Complete electrical performance validation
- Non-destructive and destructive internal analysis
- Reliability and ESD check
For ruggedized applications, STS can upscreen commercial off-the-shelf (COTS) components to a high Technology Readiness Level (TRL). We maintain direct contact with semiconductor suppliers and distributors to ensure a continuous source of supply. STS has a complete suite of design, simulation, evaluation and extended test capabilities for a wide variety of custom multi-chip packages.