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Hi-Reliability Products
Radiation Characterization, Advanced Packaging, Parts/Program Management, Reliability Analysis, Manufacturing Process / Material Optimization
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Specialty Assembly
Advanced Specialty Packages; Flip Chip, Ceramic and Hermetic Package Assembly, SOC, MEM’s, COB’s, PEM’s, CSP’s and Specialty Micro BGA
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Reliability & Qualification
Full Environmental and Mechanical Testing for both Level I (Component) and Level II (Board). Up to 45nm Technology Evaluation
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ESD & Latch-up
Fastest Automated HBM/MM/CDM/Latch-up with 2304-Pin Capability. Gate Leakage Oxide Test, Contact Air Discharge
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ATE Solutions
Test Program Development, Test Program Conversion, Test Plans, Product Characterization, Production Testing, Digital, Mixed Signal & RF Testing
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Hardware Design & Manufacturing
High Speed - High Performance PCB, Probe Cards, ATE Interfaces, Burn-in Boards. Complete Design and Layout, Manufacturing, BOM |
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Silicon Turnkey Solutions provides complete High-Density packaging/ manufacturing solutions using advanced assembly technologies
Assembly of Advanced Packages
- High Density / High Precision Flip Chip Packages
- Specialty Micro BGA
- Ceramics
- Hermetics
- MCM/ MEM’s
- SIP/ SOC
- Stacked Die/ Packages
Superior System-on-a-Board Packaging
- Expertise in Substrate Design, Characterization and Manufacturing
- Assistance in Selection of Package, Board or Substrate
- Thermal and Stress Design
- Coordination of all Bumping Services
- Automated Screen Printing
- Pick & Place for as Low as 0.1mm Bump Pitch Devices
- Rapid Prototyping
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