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Hi-Reliability Products
Radiation Characterization, Advanced Packaging, Parts/Program Management, Reliability Analysis, Manufacturing Process / Material Optimization
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Specialty Assembly
Advanced Specialty Packages; Flip Chip, Ceramic and Hermetic Package Assembly, SOC, MEM’s, COB’s, PEM’s, CSP’s and Specialty Micro BGA
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Reliability & Qualification
Full Environmental and Mechanical Testing for both Level I (Component) and Level II (Board). Up to 45nm Technology Evaluation
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ESD & Latch-up
Fastest Automated HBM/MM/CDM/Latch-up with 2304-Pin Capability. Gate Leakage Oxide Test, Contact Air Discharge
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ATE Solutions
Test Program Development, Test Program Conversion, Test Plans, Product Characterization, Production Testing, Digital, Mixed Signal & RF Testing
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Hardware Design & Manufacturing
High Speed - High Performance PCB, Probe Cards, ATE Interfaces, Burn-in Boards. Complete Design and Layout, Manufacturing, BOM |
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June 15, 2009
STS Acquires Seiko Epson 8040 Handler
June 2, 2009
STS and LTX-Credence enter a Business Collaboration
Feb 10, 2009
Raising the Bar on High Speed and High Pin Count with Verigy V93000 PS
Feb 10, 2009
Enhancing our RF testing solutions with Verigy Port Scale RF
Feb 02, 2009
AS9100 Certification Awarded to STS
Press Release by SRI
Nov 01, 2008
STS acquires multiple
UF3000EX – 12 Probers
August 01, 2008
STS partners with Sonix, Inc.
Press Release by Sonix, Inc.
June 09, 2008
STS and Credence Systems Corporation enter into Collaborative Partnership
Press Release by Credence
June 01, 2008
STS adds a new Verigy V93000 SoC with Pin Scale Performance
Press Release by STS
March 20, 2008
STS acquires Wyle's Santa Clara Test Operations
Press Release by STS
Press Release by Wyle Laboratories |
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