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Hi-Reliability Products
Radiation Characterization, Advanced Packaging, Parts/Program Management, Reliability Analysis, Manufacturing Process/Material Optimization.
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Specialty Assembly
Advanced Specialty Packages; Flip Chip, Ceramic and Hermetic Package Assembly, SOC, MEM’s, COB’s, PEM’s, CSP’s and Specialty Micro BGA.
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Reliability & Qualification
Full Environmental and Mechanical Testing for both Level I (Component) and Level II (Board). Up to 45nm Technology Evaluation.
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ESD & Latch-Up
Fastest Automated HBM/MM/CDM/Latch-up with 2304-Pin Capability. Gate Leakage Oxide Test, Contact Air Discharge.
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ATE Solutions
Test Program Development, Test Program Conversion, Test Plans, Product Characterization, Production Testing, Digital, Mixed Signal & RF Testing.
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Hardware Design & Manufacturing
High Speed - High Performance PCB, Probe Cards, ATE Interfaces, Burn-In Boards. Complete Design and Layout, Manufacturing, BOM. |
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Company News |
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April 24 - 25, 2012
STS is proud to be a Gold Sponsor at the VOICE 2012 Users and Partners
Conference, in San Jose, CA.
April 24 - 25, 2012
Gold Sponsor at VOICE 2012
Read More...
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News Archives |
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