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Hi-Reliability Products
Radiation Characterization, Advanced Packaging, Parts/Program Management, Reliability Analysis, Manufacturing Process/Material Optimization.
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Specialty Assembly
Advanced Specialty Packages; Flip Chip, Ceramic and Hermetic Package Assembly, SOC, MEM’s, COB’s, PEM’s, CSP’s and Specialty Micro BGA.
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Reliability & Qualification
Full Environmental and Mechanical Testing for both Level I (Component) and Level II (Board). Up to 45nm Technology Evaluation.
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ESD & Latch-Up
Fastest Automated HBM/MM/CDM/Latch-up with 2304-Pin Capability. Gate Leakage Oxide Test, Contact Air Discharge.
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ATE Solutions
Test Program Development, Test Program Conversion, Test Plans, Product Characterization, Production Testing, Digital, Mixed Signal & RF Testing.
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Hardware Design & Manufacturing
High Speed - High Performance PCB, Probe Cards, ATE Interfaces, Burn-In Boards. Complete Design and Layout, Manufacturing, BOM. |
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Company News |
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January 5, 2012
Silicon Turnkey Solutions Attains ISO 13485 Certification
Read More...
December 8, 2011
Silicon Turnkey Solutions Inc., (STS) Receives
the Prestigious Northrop Grumman 2011
World Class Team Supplier Award
Read More...
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News Archives |
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