Microelectronics and Hardware manufacturing services, leader, Specialty Assembly, Hi-Reliability, Automotive Qualification

Microelectronics Manufacturing
 
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Specialty Assembly
 
EnablingGreener Electronics
Full Qualification Regime for Battery Testing, Solar Cells, Modules and PVC'S
  
Hi-Reliability Products
Radiation Characterization, Advanced Packaging, Parts/Program Management, Reliability Analysis, Manufacturing Process / Material Optimization
Specialty Assembly
Advanced Specialty Packages; Flip Chip, Ceramic and Hermetic Package Assembly, SOC, MEM’s, COB’s, PEM’s, CSP’s and Specialty Micro BGA
Reliability & Qualification
Full Environmental and Mechanical Testing for both Level I (Component) and Level II (Board). Up to 45nm Technology Evaluation
ESD & Latch-up
Fastest Automated HBM/MM/CDM/Latch-up with 2304-Pin Capability. Gate Leakage Oxide Test, Contact Air Discharge
ATE Solutions
Test Program Development, Test Program Conversion, Test Plans, Product Characterization, Production Testing, Digital, Mixed Signal & RF Testing
Hardware Design & Manufacturing
High Speed - High Performance PCB, Probe Cards, ATE Interfaces, Burn-in Boards. Complete Design and Layout, Manufacturing, BOM

STS has consistently been at the forefront of technology focusing on semiconductor design enabling turnkey, testing and packaging solutions. We facilitate rapid product deployment with the most comprehensive and proven in-house portfolio of services.

Product Offerings:

  • Complete Turnkey Solutions
  • Multi-Chip Modules/Die Stacking
  • Flip Chip, SOP
  • Specialty Micro BGA
  • Ceramics
  • Known Good Die (KGD)
  • System-on-Board (SOB)
  • System-on-Chip (SOC)
  • System-in-Package (SIP)
  • Custom Packages
  • Test Development

Solutions:

  • 300mm Wafer Sort
  • Advanced Packaging Solutions
  • Test Production
  • Drop Stock
  • Box Stock Engineering
  • Complete Product and Process Reliability Services
  • Substrate Design, Characterization
    and Manufacturing
  • Thermal Stress Design