CGA Assembly

Micross STS provides a variety of Column Attach Services following identical processes, materials and workmanship standards as customers have been accustomed to from IBM.

The sheer design and craftsmanship of the patented column attach process guarantees a superior hi-reliability interconnect and best suited for assembly & component attached integrity. Our in-house highly-technical development team coupled with comprehensive electrical and thermal characterization capabilities, allow for seamless turnkey assembly and custom, build-to-suit packaging.

  • Complete Turnkey Solution (Column Attach & Test)
  • Automated IBM Process; Guarantees No Re-Work
  • 10/90 Sn/Pb Columns
  • Column Attach w/ Palladium Paste
  • Precision Coplanarity & Pitch
  • Post Column Attach Electrical Test (-55°C to +125°C)
  • Application-Specific Burn-In

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CGA Colum Grid Array